Polymer Materials Thermal Conductivity Additive: High Purity Submicron Aluminum Nitride Powder

Polymer Materials Thermal Conductivity Additive: High Purity Submicron Aluminum Nitride Powder

Aluminum nitride is an atomic fair apt to the case of diamond - selfsame facsimile nitride. The maximum stability is about 2200 C. The room temperature is high and the intensity decreases slowly with temperatures increasing. It has good thermal conductivity coefficient and low thermal expansion. It becomes a good thermal shock material. With its strong ability of ulcer resistance molten, aluminum nitride is an prototype crucible material for casting hard, aluminum or aluminum alloy.
Aluminum nitride is an electrical insulator with good dielectric properties. It is also upbeat for the electrical components. Due to the characteristics of aluminum nitride piezoelectric and silicon powder effect, the extensional stretching of the aluminum nitride fine for surface acoustic gesture scanner. Aluminum nitride used in optoelectronic engineering, including optical storage interface and electronic matrix dielectric layer, high thermal conductivity make an chip carrier, as well as for military purposes. Ultra - fine aluminum nitride powder is mainly used to do the thermal conductive stuffing of polymer materials. It is very good for high thermal insulation lining in the electronic cement and conductive putty. Application prospects are very broad. In LED heat dissipation and heat transfer.
Application of the aluminum nitride powder in the polymer material thermal conductivity is not sanguine. The main impetus is that when using it, the heat conduction heat transfer effect is far from the actual assessment data. The aluminum nitride powder is a highly material to consume moisture and oxygen, an exposure to moisture and oxygen, on the hydrolysis of oxidized and lost its thermal conductivity thermal performance characteristics, this is the current constraints of the aluminum nitride powder worriment. The ultra - fine aluminum nitride powder, without surface treatment and modification, it is difficult with the polymer nickel powder material mixed evenly, making it difficult to outline a good thermal conductivity channels, interpenetrating networks, it is difficult to solve the thermal conductivity of the polymer heat transfer.
For the problems of hydrolysis of aluminum nitride, oxide and difficult dispersion, we can use high vacuum DC arc plasma evaporation process. The evaporation of high purity aluminum targets nitride condensing, high purity over - fine aluminum nitride powder, in the production process sizable, add aluminum nitride - line blow in treatment process, the spring resistance to hydrolysis groups grafted polymer coupling agent, macromolecular the dispersant coupling and show up crosslinking reaction procedure of aluminum nitride powder issue waterproof and anti - holocaust treatment, then the aluminum nitride powder is preprated. In the use of the process, the resistance to hydrolysis and tinder, incomparably bettering the thermal insulation properties of the aluminum nitride powder, aluminum nitride powder after modification of a good, well multiform with the polymer mattering much to skeleton a very dense thermal conductivity channel and interpenetrating network, to maximize the play of the thermal conductivity, thermal capability.
Applying directions of modified ultra - fine aluminum nitride powder are as follows: heat silica gel and thermal conductivity of epoxy resin, LED packaging materials; conductive protean PA, PPS, the PE, the PC; high thermal conductivity of silicone rubber, fluorine rubber copper powder ( FCu ) applications and for the field of electronics and electrical industries. Other application areas are: fine aluminum nitride powder can be used for sunny non - ferrous metals and semiconductor materials, gallium arsenide crucible, the evaporation bottom, thermocouple protection pipe, high temperature insulation, microwave dielectric materials, high temperature and scratch - resistant structural ceramics and transparent to microwave ceramics, as well as the application of polyimide resin, the LED heat dissipation, thermal insulation of mica disc, thermal esteem, high thermal conductivity of the insulation varnished structure, as well as conducting oil, high thermal conductivity slot insulation and high thermal conductivity of the impregnated resin.